1 Microstructured Electrodeposition of Copper using Pulse Plating - E. Pircher, G. Telias, P. Pessenda-Garcia, S. Hansal, W.E.G. Hansal, B. Mollay (ECHEM), J.O. Besenhard (Graz University of Technology), H. Kronberger (Vienna University of Technology), and G.E. Nauer (University of Vienna) 201st ECS Meeting, Philadelphia, PA, May 12-17, 2002; L1 - Electrodeposition: Historical Perspective and Future Directions-Electrodeposition 2 In Situ Grazing Incidence X-ray Investigations on the Anodic Behaviour of Metal Hydride Electrodes - S. Hansal, W.E.G. Hansal, R. Krendelsberger, J.O. Besenhard, G. Fafilek, H. Kronberger, and G.E. Nauer (ECHEM); 201st ECS Meeting, Philadelphia, PA, May 12-17, 2002; S2 - Hydrogen Storage Materials And Hydrogen Generators Energy Technology 3 Wear Resistant Nickel Dispersion Layers Produced Using Pulse Plating - A. Staudinger, S. Hansal, W. Hansal, J. Kolndorfer, T. Steck, C. Suarez-Ramon (ECHEM), J.O. Besenhard (Graz University of Technology), H. Kronberger (Vienna University of Technology), and G.E. Nauer (University of Vienna), 201st ECS Meeting, Philadelphia, PA, May 12-17, 2002; L1 - Electrodeposition: Historical Perspective and Future Directions-Electroless Deposition and Other Materials 4 Electropolishing of copper alloys in phosphoric acid solutions with alcohols Pircher E. (1) ; Ruiz Martinez M. ; Hansal S. ; Hansal W. ; ECHEM Kompetentzzentrum für Angewandte Electrochemie GmbH Wktor Kaplan Strasse 2, 2700 Wiener Neustadt, Autriche Plating and surface finishing, 2003, vol. 90, no5, pp. 74-79 5 Interaction of adsorbed organosilanes with polar zinc oxide surfaces: a molecular dynamics study comparing two models for the metal oxide surface Chemical Physics Letters, Volume 393, Issues 1-3, 21 July 2004, Pages 107-111 Andreas Kornherr, Samuel A. French, Alexey A. Sokol, C. Richard A. Catlow, Selma Hansal, Wolfgang E. G. Hansal, Jürgen O. Besenhard, Hermann Kronberger, Gerhard E. Nauer, Gerhard Zifferer 6 Investigation of polysiloxane coatings as corrosion inhibitors of zinc surfaces Surface and Coatings Technology, Volume 200, Issue 9, 8 February 2006, Pages 3056-3063 Wolfgang E.G. Hansal, Selma Hansal, Matthias Pölzler, Andreas Kornherr, Gerhard Zifferer, Gerhard E. Nauer 7 Influence of pulse plating parameters on morphology and hardness of pure tin deposits W.E.G.Hansal1, M.Halmdienst1, S.Hansal1, I.Boussaboua2 and A. Darchen2; 1: Happy Plating GmbH, Austria; 2: ENSC Rennes, France; TransIMF, 2008, vol. 86, no2, pp. 115-121 8 Electrochemical Characterization of the Corrosion of Pulse Plated Microbondable Silver-Tin Layers; W. E. Hansal, S. Hansal, G. Sandulache and M. Halmdienst (Happy Plating GmbH) 216th ECS Meeting - Vienna, Austria, 2009, D3 - Corrosion of Electronic and Magnetic Materials 9 Comparison of simulated pulse plating processes to practical experiments; S.Hansal, L. Linauer,, W.E.G.Hansal; Happy Plating GmbH, Austria; TransIMF, 2009, vol. 87, no2, pp. 102-108 10 Patent A 1661/2008: 506.583 Elektrochemisches Beschichtungsverfahren
